Nikkei: TSMC to Lift Wafer Prices by as Much as 10% From 2027

TSMC is preparing to raise prices for both advanced and mature-node chip manufacturing by up to 10% starting in 2027, as it seeks to offset higher costs for materials, production equipment and the build-out of new overseas fabs, Nikkei Asia reported, citing multiple sources. Sources said TSMC has already opened talks with customers on hikes covering 7-nanometer processes and more advanced nodes, a segment that contributed about 77% of revenue in the April–June quarter. The base increase is expected to run 5% to 10%, depending on the customer and product. For incremental high-performance computing (HPC) orders that exceed customers' original forecasts, TSMC plans to add a further 10% to 15% premium on top of the base hike. That could push total price increases for some advanced-node orders above 10%. For mature nodes—including 12nm, 16nm, 28nm and other legacy processes—TSMC is targeting a ceiling of 10%, with some products seeing smaller adjustments. Mature-node operations made up roughly 23% of revenue in the prior quarter. The negotiations began around June and were wrapped up in July, the sources said, with the new pricing slated to take effect in early 2027. (Jinshi)